| 发明名称 |
SMD circuit board manufacture |
| 摘要 |
<p>Conductor tracks (12,20) to be connected to each other during component mounting are connected electrically via a bridge comprising a solderable, conductive wire (30). Electrically conductive and nonconductive components, especially conductive tracks (14,16,18) are bridged. The bridge may be a non-insulated wire.</p> |
| 申请公布号 |
DE19753125(A1) |
申请公布日期 |
1999.06.02 |
| 申请号 |
DE1997153125 |
申请日期 |
1997.11.29 |
| 申请人 |
AKO-WERKE GMBH & CO KG, 88239 WANGEN, DE |
发明人 |
PFLEGHAR, ROLAND, 88239 WANGEN, DE |
| 分类号 |
H05K3/22;H05K3/28;H05K3/34;H05K13/06;(IPC1-7):H05K3/32;H05K3/10;H05K13/04 |
主分类号 |
H05K3/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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