Circuit board contact-point and edge-connector manufacturing method

摘要

A method of manufacturing contact-points on edge-connectors of a circuit board, which are provided at given points on the available board structure, in which the soldering material applied in the printing process can be melted by a heating effect in the soldering process. The soldering material is also applied in the region of the edge-connectors and the applied soldering material has recesses/gaps (8) in the soldered areas, which are matched in shape and area to the given properties of the soldering material, so that after melting of the solder material, a corrosion protected contact point is made available and is optimised for the contact function.