| 摘要 |
PROBLEM TO BE SOLVED: To provide a high resistivity soft magnetic film by a plating method with low costs and superior mass productivity, while being impossible to obtain a composite plating film having an element oxide phase and magnetic metallic phase the deposition potential of which is lower than the decomposition potential of water in a conventional manner. SOLUTION: A composite plating film can be obtained by conducting an alternating current electrolysis in an aqueous solution, including both element ion and magnetic metallic ion whose deposition potential is lower than the decomposition potential of water. Especially, a structure in which oxides of such element as Tb, Sm, Dy, Nd, Y, Hf, Zr, and Si are segregated in a grain boundary by using fine particles of magnetic metal, whose crystal particle diameter is 1,000Åor less, as main components is realized, so that a high resistivity soft magnetic film can be formed by a plating method.
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