| 摘要 |
PROBLEM TO BE SOLVED: To obtain a hydrazide epoxy resin curing agent having excellent curability and humidity resistance and an epoxy resin adhesive composition containing the same. SOLUTION: There are provided an epoxy resin curing agent comprising a product of grinding of an adduct obtained by reacting under heating a solid epoxy resin having at least one epoxy group in the molecule, a softening temperature of 50-140 deg.C and an epoxy equivalent (n) (wherein (n) has a value of 200-10,000) with a hydrazide compound represented by the formula: R(CONHNH2 )m (wherein R is an m-valent residue of an m-basic polycarboxylic acid; and (m) is an integer of 2-4) in such amounts that the solid epoxy resin is used in an amount of 0.1×(n) to (n)×(2m-2) g (wherein (n) has a value of 200-10,000; and (m) is an integer of 2-4) and a heat-curing epoxy resin composition essentially consisting of the curing agent and an epoxy resin having at least two epoxy groups in the molecule.
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