| 发明名称 |
Bi-level injection molded leadframe |
| 摘要 |
A x-y array of light emitting diodes has insert molded leadframes to minimize manufacturing costs during assembly. |
| 申请公布号 |
US5909037(A) |
申请公布日期 |
1999.06.01 |
| 申请号 |
US19980005908 |
申请日期 |
1998.01.12 |
| 申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
RAJKOMAR, PRADEEP;BEECHER, WILLIAM J. |
| 分类号 |
H01L25/075;H01L33/48;H01L33/62;(IPC1-7):H01L33/00 |
主分类号 |
H01L25/075 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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