发明名称 Device for selectively using position determination chuck or camera to correct position of a component for mounting on printed circuit board
摘要 A component mounting device mounts electronic components from several component stages on a printed circuit board. The component mounting device includes a mounting head, a camera unit, and a selection unit. The mounting head, movably installed between the component stage and the printed circuit board, includes a suction element and a position determination chuck. The suction element picks up and thereafter supports the component, and the position determination chuck corrects the position of the supported component. The camera unit, installed within a movement range of the mounting head, receives an image of the component supported by the suction element. The selection unit selects either the position determination chuck or the camera unit to correct the position of the component supported by the suction element. The component mounting device selectively corrects the position of the component supported by the suction element by using the position determination chuck or by processing the image received by the camera unit based on the selection by the selection unit.
申请公布号 US5907900(A) 申请公布日期 1999.06.01
申请号 US19970787328 申请日期 1997.01.28
申请人 SAMSUNG AEROSPACE INDUSTRIES, LTD. 发明人 OKAZAKI, TADAO;AONO, HIDEAKI
分类号 H01L21/02;H05K13/04;(IPC1-7):H05K3/30 主分类号 H01L21/02
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