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发明名称
SEMICONDUCTOR CHIP PACKAGE FOR HIGH FREQUENCY
摘要
申请公布号
KR100190282(B1)
申请公布日期
1999.06.01
申请号
KR19960033213
申请日期
1996.08.09
申请人
SAMSUNG ELECTRONICS CO, LTD.
发明人
LEE, KYUNG-SEON
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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