| 摘要 |
PROBLEM TO BE SOLVED: To improve the operating rate of equipments and quality and to reduce the cost of the equipments by equalizing the positions and shapes of orientation film patterns on upper and lower substrates and sharing an orientation film printed board by both the upper and lower substrate. SOLUTION: Orientation film patterns 101a, 101b corresponding to respective chips formed on the surfaces of upper and lower substrates 102a, 102b are respectively symmetrically arranged about respective center lines BXa (or BYa), BXb (or BYb) in the vertical (or horizontal) direction of these substrates 102a, 102b so that the patterns 101a, 101b of the same shape are arranged on the same positions of the upper and lower substrates 102a, 102b when the substrates 102a, 102b are stuck to each other in a state turning their orientatiton film printed faces to the inside. |
