HEAT RADIATING APPARATUS FOR ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide a heat radiating structure by which heat influx from a circuit board and other heating parts is prevented and temperature rise of electronic parts mounted on a small-sized electronic apparatus is reduced. SOLUTION: An opaque thermal conductive member 6 in the form of a plate is disposed on the surface of a substrate 1 on which heating electronic parts are mounted or between electronic parts and the surface of a substrate 1 on or near which the electronic parts are disposed. The thermal conductive plate member 6 itself has a heat radiating part or it is in contact with a separate heat conductive material 8 for dissipating heat from the substrate 1 or the heating parts 2 on the substrate to a heat radiating member 7 to prevent temperature rise of the electronic parts disposed on or near the surface of the substrate 1.