| 摘要 |
PROBLEM TO BE SOLVED: To increase the density of both circuit sections between a pair of circuit boards which are laminated upon another with an inter-layer insulating layer inbetween by electrically connecting the circuit sections at a position, where the circuit sections do not face opposite each other. SOLUTION: A first semiconductor chip 2 and a second semiconductor chip 3 are laminated upon another with an inter-layer insulating layer 4 in between, and a first conducting path 9 is formed via the insulating layer 4, so as to electrically connect the first electrode 6a of a first semiconductor integrated circuit section 5, which is formed so that both the sides of the section 5 are electrically connected to the electrodes and provided in such a positional relation with a second semiconductor circuit section 7a that the sections 5 and 7a do not face opposite to each other to the first electrode 8a of the second circuit section 7a. The insulating layer 4 is formed of a plurality of insulating films 11-16 laminated upon another, and first conductive sections 11a-16a which are formed so that the films 11a-16a do not face opposite to both the first electrodes 6a and 8a and are shifted successively in a partially overlapped state between adjacent insulating films 11-16 and form the first conductive path 9, when the sections 11a-16a are connected electrically to each other. |
