| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer positioner intended to reduce the damages to a wafer, improve the wafer positioning accuracy, and reduce the wafer positioning time. SOLUTION: A stage 15 for mounting a wafer 'a' is rotated. A laser displacement sensor 17. A side face of the wafer is irradiates with a laser beam by a laser displacement center 17 which is being rotated and receives the laser beam reflected from its side face. A controller obtains the position of the orientation flat 1a of the wafer a and deviation of the wafer center from the rotary center of the stage 15, based on a signal corresponding to the light quantity received, rotates the stage 15 to position the obtd. orientation flat a1 in the X-axis direction, and drives and X and Y-axis drive motors 7, 13 to move the stage 15, thereby positioning the center of the wafer 'a' to a target position and correcting it, based on the obtd. deviation.</p> |
