| 摘要 |
PROBLEM TO BE SOLVED: To increase the electronic component packing density of a circuit board by means of a compound electronic circuit device. SOLUTION: The electronic component packaging density of a circuit board 11 per unit area is increased by fixing a second insulator sealing body 43 which seals a second electronic circuit 41 of a second semiconductor device 13 on the other main surface 30b of the first insulator sealing body 3 of a first semiconductor device, one main surface 30a which is fixed to the circuit board 11 and which seals a first electronic circuit 28. A first lead 25 led out from the first insulator sealing body 30 is connected electrically to a conductor 15 wired on the circuit board 11 and second leads 39 and 40 led out from the second insulator sealing body 43 are respectively connected electrically to conductors 18 and 19 of the circuit board 11. |
