| 摘要 |
PROBLEM TO BE SOLVED: To provide an image pickup device, which has satisfactory positioning accuracy by solving the problem of no coincidence between the light receiving plane of a solid-state imaging device and the optical axis of a lens caused by non-uniformity in the thickness of an adhesive when attaching a semiconductor substrate mounting the solid-state imaging device or the like to a lens holder, concerning the image pickup device integrating the solid-state imaging device or the like and an optical system. SOLUTION: A stepped part 27 is provided at a lower frame body peripheral frame 26 of a lens holder 25 and when mounting a semiconductor substrate 30 from the bottom part of the lens holder 25, an electrode terminal 36 on the surface of the stepped part 27 and an electrode pad 34 on the peripheral upper surface of the semiconductor substrate 30 are electrically connected by anisotropic conductive paste 31. Then, the lens holder 25 and the semiconductor substrate 30 are sealed with air-tightness, a printed wiring board 39 is mounted on the base of the frame body peripheral frame 26 of the lens holder 25, and a connecting terminal 41 of the printed wiring board 39 is connected with a lead terminal 38 of the lower frame body peripheral frame 26. |
