| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent tablet chipping resistance, soldering crack resistance, thermal cycling resistance and electrical insulation. SOLUTION: This resin composition contains an epoxy resin, a phenolic resin, an inorganic filler, a cure accelerator and acrylonitrile-butadiene rubber powder as essential components. The acrylonitrile-butadiene rubber powder contains carboxyl group, epoxy group or a phenolic hydroxyl group and has an acrylonitrile modification ratio of 20-50 wt.% and a particle diameter of 5-50,000 nm The amount of the acrylonitrile-butadiene rubber powder is 0.1-20 pts.wt. based on 100 pts.wt. of the total epoxy resin. |
