| 摘要 |
PROBLEM TO BE SOLVED: To form uniform plating films without variations in film thickness of the plating films among respective plating parts. SOLUTION: The device for plating small parts has a plating bath tub 2 which stores a plating liquid 11, a cathode 7 which is immersed into the plating liquid 11 of this plating bath tub 2 and with which the plating parts (a) to be plated come into contact, an anode 6 which is immersed into the plating liquid 11 of the plating bath tub 2 and a power source 10 which passes an electric current to the anode 6 and the cathode 7. The cathode 7 is formed to a sheet form to allow the passage of the plating liquid 11 and has a position adjusting means for restricting the position to be placed with the plating parts (a) to the central part on the main surface of the cathode 7 on the main surface to be placed with the plating parts (a) of the cathode 7. This position adjusting means consists of, for example, partition plates 16 to segment the main surface of the cathode 7 to plural blocks. |
