发明名称 POLISHING DEVICE AND ABRASIVE LIQUID SUPPLYING SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To provide an abrasive liquid supplying device having the low cost of equipment and capable of stably supplying abrasive liquid having the constant flow rate to a plurality of polishing devices. SOLUTION: In an abrasive liquid supplying device for supplying abrasive liquid to one or a plurality of polishing devices is provided with a main piping 20 through which abrasive liquid is to be allowed to flow, and extraction pipings 24 extending from the main piping 20 to polishing devices 4, and a flow control means 54 for adjusting the flow rate by adjusting the valve opening on the basis of a command signal is provided on at least one extraction piping 24. In this case, since abrasive liquid in an abrasive liquid piping for guiding abrasive liquid to respective polishing devices 4 is always circulated, the liquid concentration can be prevented from being changed caused by staying of the abrasive liquid in the abrasive liquid piping, and also clogging caused by deposition of solid matters can be prevented.</p>
申请公布号 JPH11138438(A) 申请公布日期 1999.05.25
申请号 JP19970316216 申请日期 1997.10.31
申请人 EBARA CORP 发明人 KAWASHIMA KIYOTAKA
分类号 B24B57/02;B24B37/00;H01L21/304;(IPC1-7):B24B57/02 主分类号 B24B57/02
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