| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a module for IC card capable of completing the module for IC card with a uniform thickness shape. SOLUTION: The method is for manufacturing the module A for IC formed on which an IC chip 2 integrated with a base material 1 is formed as sealed structure after joining and mounting the IC chip 2 on the base material 1 and it is characterized by a fast that the surface of a sealing material 5 is uniformly flattened by rotating power of a rotary table 11 by mounting a mold 10 for sealing in which the base material 1 is stored on the rotary table 11, after that, dropping a liquid sealing material 5 for the IC chip 2 on the base material 1 and rotating the rotating table 11 in a horizontal surface. |
