发明名称 THERMOELECTRIC DEVICE USING SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To suppress the heat generation from the high-temperature end of the first thermoelectric semiconductor member of a thermoelectric device by providing a light-emitting region which is formed of a semiconductor material, collects first carriers transported to the high-temperature end of the first thermoelectric semiconductor member, and emits light through the recombination of electrons with holes. SOLUTION: A metal M1 is connected to the low-temperature end CC of an n-type thermoelectric semiconductor S1 and a semiconductor (light-emitting region) S2 in which electrons are recoupled with holes for light emission, a P-type semiconductor S3 having a band gap larger than that of the semiconductor S2 has, and a metal M2 are successively connected in this order to the high-temperature end CH of the semiconductor S1 . At the low-temperature end CC, an endothermic reaction takes plate due to, for example, Peltier effect, etc. The energy of all the electrons transported to the high-temperature junction CH is not converted into thermal energy, but part of the energy is converted into light energy by interband transition. Therefore, the heat generation at the high-temperature end CH can be suppressed.
申请公布号 JPH11135846(A) 申请公布日期 1999.05.21
申请号 JP19970300717 申请日期 1997.10.31
申请人 FUJITSU LTD 发明人 HIDAKA NORIO
分类号 H01L31/10;H01L33/12;H01L33/22;H01L35/00;H01L35/14;H01L35/32;H02N11/00 主分类号 H01L31/10
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