发明名称 Combined wet etching method for stacked films and wet etching system used for same
摘要 A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more types of etching methods are performed in combination, on stacked films containing first and second films being deposited sequentially on a substrate and each having a different film property. The two or more types of wet etching methods include, at least, a first wet etching method in which side-etching on the first film is facilitated more than side-etching on the second film and a second wet etching method in which side-etching on the second film is facilitated more than side-etching on the first film.
申请公布号 US7291283(B2) 申请公布日期 2007.11.06
申请号 US20030704562 申请日期 2003.11.12
申请人 NEC LCD TECHNOLOGIES, LTD. 发明人 UESUGI TADANORI;KIMURA SHIGERU
分类号 B44C1/22;H01L21/306;C23F1/00;C23F1/02;C23F1/08;H01L21/00;H01L21/3213;H05K3/06 主分类号 B44C1/22
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