| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing apparatus which can perform a series of operations including resist treatment over an object to be processed under a condition of a predetermined cleanness level, while eliminating the influences of ambient temperature and humidity. SOLUTION: A processing apparatus includes a processor 100 for performing a series of coating operations over a semiconductor wafer W, and a temperature/humidity controller provided above the processor for controlling the temperature and humidity of a vertical laminar flow in an introduced clean air and supplying the controlled clean air to the processor 100. The processor 100 has a transportation passage 102, a plurality of processing units 102 to 108 provided along the transportation path 102 for performing predetermined operations over the wafer W, and a transportation mechanism 110 for moving the transportation passage 102 to feed the wafer W into and out of the respective processing units. |
