| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition being excellent in humidity resistance after surface mounting by IR reflow, reflow resistance and moldability and being made proof against peel between a semiconductor chip and a lead frame and internal resin crack by including an epoxy resin having a specified composition, a phenolic resin and an inorganic filler. SOLUTION: This composition is prepared by compounding an epoxy resin of formula I with a phenolic resin of formula II (wherein n is 0 or 1 or greater), 25-95 wt.% at least one inorganic filler selected among a silica powder, an alumina powder, a silicon nitride powder, antimony trioxide, talc, calcium carbonate, titanium white, clay, mica, red iron oxide, glass fibers, etc., each of which has a maximum particle diameter of 100μm or below and a mean particle diameter of 30μm or below and optinally a mold release agent, a flame retardant, a colorant, a stress lowering agent, etc., thoroughly mixing the resulting mixture, melt-mixing the obtained mixture, solidifying the melt by cooling and grinding the solid to a suitable size.
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