| 发明名称 |
Process for making a multilayer interconnect system |
| 摘要 |
A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.
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| 申请公布号 |
US3953924(A) |
申请公布日期 |
1976.05.04 |
| 申请号 |
US19750591591 |
申请日期 |
1975.06.30 |
| 申请人 |
ROCKWELL INTERNATIONAL CORPORATION |
发明人 |
ZACHRY, CLYDE L.;NIEDZWIECKE, ANDREW J. |
| 分类号 |
H05K1/00;H05K3/24;H05K3/38;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):B41M3/08 |
主分类号 |
H05K1/00 |
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