发明名称 CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
摘要 The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer. <IMAGE>
申请公布号 KR100179404(B1) 申请公布日期 1999.05.15
申请号 KR19940001622 申请日期 1994.01.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKAMURA, YOSHIFUMI;BESSHO, YOSHIHIRO;YUHAKU, SATORU;HAKOTANI, YASUHIKO;ITAGAKI, MINEHIRO;MIURA, KAZUHIRO
分类号 H01L21/48;H05K1/03;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 主分类号 H01L21/48
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