发明名称 Miniaturised electronic circuit module, especially for mobile telephones
摘要 The use of a flexible circuit board allows the circuit to be folded. The miniaturised electronic module comprises a number of components (2,3,4) and a flexible interconnection interface (1) on which the components are assembled.The flexible support is intended to be folded to provide several overlapping layers, such that the folded assembly fits into a rectangular box. A casing is fitted around the folded assembly holding the rectangular configuration. One portion of the interconnection interface (21) projects from the box, enabling connection to external circuits. The interface may include balls of solder to allow formation of soldered joints, and may also include a number of test connection points
申请公布号 CH689502(A5) 申请公布日期 1999.05.14
申请号 CH19970001271 申请日期 1997.05.30
申请人 VALTRONIC S.A. 发明人 JEAN-FRANCOIS ZEBERLI
分类号 H01L23/538;H01L25/065;H01L25/16;H05K1/18;(IPC1-7):H01L27/00;H05K1/00;H01R9/00 主分类号 H01L23/538
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