摘要 |
A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 mu m and specific surface of from 0.1 to 1.5 m<2>/g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique. The conductive paste comprises a metallic particle 103 such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate 101. Then, this substrate is heated and pressurized together with copper foil 102 on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected. <IMAGE> |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA, OSAKA, JP;DAI-ICHI KOGYO SEIYAKU CO., LTD., KYOTO, JP;DOWA MINING CO., LTD., TOKIO/TOKYO, JP |
发明人 |
KAWAKITA, KOUJI,, JOYO-SHI, KYOTO 610-01, JP;NAKATANI, SEIICHI,, HIRAKATA-SHI, OSAKA 573, JP;OGAWA, TATSUO,, AMAGASAKI-SHI,HYOGO 661, JP;SUEHIRO, MASATOSHI,, NISHIGYO-KU, KYOTO-SHI, KYOTO 615, JP;IWAISAKO, KOUICHI,, UJI-SHI, KYOTO 611, JP;AKIYAMA, HIDEO,, FUSHIMI-KU, KYOTO-SHI, KYOTO 612, JP |