Verbindungsteil eines Schaltungssubstrats und Verfahren zur Herstellung mehrschichtiger Schaltungssubstrate unter Verwendung dieses Teils

摘要

A connecting member of circuit substrates includes an organic porous base material (102) provided with tackfree films (101) on both sides, through-holes (103) disposed at requested places which are filled with conductive resin compound (104) up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality.