发明名称 CHEMICAL SUPPLYING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a chemical supplying apparatus by which chemical can be constantly supplied to a treating apparatus. SOLUTION: A slurry supplying apparatus 11 is provided with mixing tanks 12a and 12b whose capacity is set in accordance with the necessary amount of slurry which is used for one treatment in polishing devices 18a and 18b. A controlling device supplies a necessary amount of undiluted slurry 15 and 16 and pure water to the mixing tanks 12a and 12b and dilutes and mixes them to form slurry 17. Then the controlling device supplies the slurry 17 formed in this way to the polishing devices 18a and 18b. Accordingly, since only a necessary amount of slurry 17 for the polishing devices 18a and 18b is formed in the mixing tanks 12a and 12b, no excessive slurry remains after forming.</p>
申请公布号 JPH11126764(A) 申请公布日期 1999.05.11
申请号 JP19970315197 申请日期 1997.11.17
申请人 FUJITSU LTD;FUJITSU VLSI LTD 发明人 HIRAOKA NAOKI;HIRAIDE KENJI
分类号 H01L21/304;B01F3/08;B01F3/12;B01F13/10;B01F15/00;B24B57/02;(IPC1-7):H01L21/304 主分类号 H01L21/304
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