发明名称 COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a component mounting device, wherein the entire device configuration is simpler and kinetic load that is generated is reduced or distributed. SOLUTION: A substrate stage 10 which, is movable in a Y-direction with a substrate 20 mounted, and first second attaching heads 30 and 60 which mounted with attaching nozzles 31a-31d, and 61a-61d, are movable in an X- direction, independently of the movement of the substrate stage to and from component supply devices 71-74 with the substrate in between, is provided. The first and second attaching heads are moved alternately in substrate direction, and the component which is vacuum-clamped with each vacuum-clamping nozzle is mounted on the substrate. Here, acceleration/deceleration of the second attaching head 60 is controlled so as to cancel a force generated by the acceleration/deceleration of the first attaching head 30. The generated kinetic load that follows the movement of the attaching head is reduced or distributed.
申请公布号 JPH11126996(A) 申请公布日期 1999.05.11
申请号 JP19970291874 申请日期 1997.10.24
申请人 JUKI CORP 发明人 NAKAMURA MASAO;INABE MASAYUKI;YOKOKURA TAKESHI;NAKAMURA AKIHIKO;NISHII YASUFUMI;MARUYAMA KOHEI
分类号 B23P19/00;B25J15/00;H05K13/04;H05K13/08 主分类号 B23P19/00
代理机构 代理人
主权项
地址