| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a high-density highly reliable multilayered printed wiring board can be manufactured efficiently by leaving conductive paste as it is for a fixed period of time in a vacuum atmosphere after non-through holes are filled up with the paste. SOLUTION: A metal foil cladding adhesive layer composed of metal foil 6 and an insulating adhesive layer 7 is put on the surface of an inner-layer substrate 4 on which an inner-layer circuit 5 is formed with the foil 6 on the outside and united with the substrate 4 in one body by pressurizing and heating. Then non-through holes 9 are formed by removing the foil 6 and layer 7 from spots at which the circuit 5 is electrically connected to the foil 6. After the holes 9 are filled up with conductive paste 10, the paste 10 is left as it is in a vacuum atmosphere for a fixed period of time. Finally, a multilayered printed board is manufactured by forming an outer-layer circuit 12 by selectively etching off the foil 6 from unnecessary spots. Therefore, a high-density highly reliable multilayered printed wiring board can be manufactured through simple processes in such a way. |
