| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive which realizes a small, high-performance, low cost semiconductor device, which has a high shelf-stability, workability and adhesion and relaxes the stress on the semiconductor based on the heat generated when the semiconductor device is assembled or when the assembled semiconductor device is used. SOLUTION: An adhesive for high-density semiconductors comprises a flexible epoxy resin, a flexible hardener, an adhesive component and a latent catalyst, which is used for attaching a semiconductor chip 7, a mount, a radiator base plate, a circuit base plate 1, etc. The adhesive may be used in a form of a sheet, a fabric, a knit or a bonded fabric, or in such forms which are cut or punched-out to fit the shape of the instruments arranged in the semiconductor device. If the adhesive is in a form of a fabric, a knit or a bonded fabric, it may be impregnated with a flexible epoxy resin, a flexible hardener, an adhesive component and a latent catalyst. Moreover, the flexible adhesive 3 may comprise multiple layers and possess a gradually-modified adhesion property. |
