| 摘要 |
<p>The apparatus has a frame (1) and a work-holding spindle (4) mounted to said frame. A drive assembly for moving a polishing spindle mounting element with respect to said frame is secured to the frame. A polishing spindle (57) is mounted on said polishing spindle mounting element for rotation about a spindle rotation axis. A drive assembly controller controls the drive assembly to move a polishing head mounted to the polishing spindle assembly along a theoretical profile while maintaining a contact force between said workpiece and said polishing head and controlling the movement of the polishing head using a predetermined velocity profile so that the polishing head removes material from the workpiece by abrasion in accordance with a predetermined material removal profile.</p> |
