发明名称 |
MANUFACTURING METHOD OF SUBSTRATE FOR SEMICONDUCTOR PACKAGE USING CONDUCTIVE INK |
摘要 |
A method for making a substrate for a semiconductor package comprising forming a conductive layer having a desired circuit pattern on the substrate; curing the conductive layer; and coining the cured conductive layer to make its surface uniform. The cured conductive layer may be plated with Ni, and subsequently with Au, and shaped to form a Au-plated board. |
申请公布号 |
KR172000(B1) |
申请公布日期 |
1999.05.01 |
申请号 |
KR19950024814 |
申请日期 |
1995.08.11 |
申请人 |
SAMSUNG AEROSPACE INDUSTRIES LTD. |
发明人 |
RYU, JAE-CHUL;SEO, WON-SIK |
分类号 |
H05K3/20;C11D1/00;C11D3/20;C11D11/00;C23G5/032;H01L21/48;H01L23/12;H05K1/09;H05K3/00;H05K3/12;H05K3/22;H05K3/24;H05K3/26;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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