| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered printed wiring layer, together with a method for manufacturing it, wherein no disconnection occurs between via holes. SOLUTION: Between a via hole 60A and via hole 60C, connection is made with a wiring 58 of line thickness W2 which is equivalent to a diameter W1 of via hole's lands 60a and 60c, with a width of the wiring 58 being wide, so that, no disconnection occurs at the wiring 58 in manufacture process. Since no joint part (connection part) exists between the wiring 58 and via hole's lands 60a and 60c, a crack may not occur at an inter-layer resin insulating layer of an upper layer or a lower layer to cause disconnection at a conductor wiring on an upper layer side or a lower layer side. |
