| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion property, heat resistance, electrical insulation, and maintenance stability, by forming a resin layer consisting of a composition with polycarbodiimide and/or modified polycarbodiimide and epoxy compound on a copper foil. SOLUTION: A laminate is formed by forming a resin layer in film shape and then laminating it to a copper foil. The resin layer consists of a composition containing polycarbodiimide and/or deformed polycarbodiimide and epoxy compound. The polycarbodiimide can be obtained by polymerization while regulating the molar amount from organic di-isocyanate and organic mono-isocyanate. Also, a deformed polycarbodiimide where at least one type of compound with a graft reactive group and a carboxylic acid anhydride group is grafted in advance can be used as at least one portion of polycarbodiimide, thus improving the adhesion property, heat resistance, electrical insulation, and maintenance stability of the lamination body. |
