| 摘要 |
PROBLEM TO BE SOLVED: To improve external quantum efficiency, by recovering efficiently a light emission from other than a light take-in surface, even with such assembly as, for example, a light emitting element is fixed by a conductive paste incorporating Ag. SOLUTION: When a light emitting element 5 wherein semiconductor layers of p-n junction are laminated on a transparent crystal substrate is bonded to a lead frame 6 or an element mounting surface 6a of a printed board with an adhesive paste 10, the crystal substrate and the lead frame 6 or the element mounting surface 6a of the printed board are bonded with application regions of at least two of spotty pastes 10, and even if Ag is incorporated for the paste 10 to be conductive, absorption of light by Ag paste is suppressed since the application range of the paste 10 is reduced, thus the reflection light from the element mounting surface side 6a is efficiently recovered to a light take-out surface side. |
