发明名称 REMOVABLE GRADE HOT MELT PRESSURE SENSITIVE ADHESIVE
摘要 <p>A removable grade hot melt pressure sensitive adhesive, comprising from about 10 % to about 50 % by weight of the adhesive of at least one styrene-isoprene-styrene block copolymer having a diblock content of greater than about 50 % a melt index of less than about 30 grams/10 minutes; from about 10 % to about 40 % by weight of the adhesive of at least one tackifying resin having a softening point of less than about 120 °C and from about 10 % to about 50 % by weight of the adhesive of a liquid plasticizer. The resultant adhesive has 180° peel values to stainless steel of less than about 4.0 pounds per linear inch.</p>
申请公布号 WO1999020709(A1) 申请公布日期 1999.04.29
申请号 US1998022407 申请日期 1998.10.22
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