MULTILAYER FILM AND LAMINATE FOR USE IN PRODUCING PRINTED CIRCUIT BOARDS

摘要

A multilayer film having as one surface layer thereof a support layer containing a thermoplastic resin able to withstand temperatures up to 200.degree.C without softening and the other surface layer being an adhesive layer containing a thermoplastic resin having a melting point ranging from 100.degree.C to 200.degree.C. Optionally, a tie layer may be employed between the support layer and the adhesive layer. The multilayer film is useful as a protective carrier sheet for a cladding metal foil used in the production of printed circuit boards. The carrier sheet provides temporary, peelable surface protection for the cladding metal foil preventing contamination and physical damage to the foil both before and during printed circuit board formation. Adhesion of the carrier sheet to the cladding metal foil, measured using a 180 degree peel test is less than 0.4 lbs./inch-width and greater than 0.005 lbs./inch-width (0.18 to 0.002 kgs/2.54 cm width), and preferably less than 0.1 lbs./inch-width and greater than 0.01 lbs./inch-width and greater than 0.01 lbs./inch-width (0.05 to 0.005 kgs/2.54 cm width).