| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the packaging property by setting the electric resistance between terminal portions on both ends at a specified value or smaller, in a chip resistor in which a conductive film is formed on a base or the base itself is electrically conductive and has a protective material provided thereon. SOLUTION: On a base 11 constituted by performing pressing, extrusion or the like of an insulating material, a conductive film 12 is formed by an evaporation method such as a plating method or a sputtering method. Then, a protective material 14 is applied on the conductive film 12 between a terminal portion 15 and a terminal portion 16 formed on both ends of the base 11. In this chip resistor, the electric resistance between the terminal portion 15 and the terminal portion 16 is set at 700 mΩor less. Conditions such as thickness and material of the conductive film 12 must be selected so that the electric resistance is preferably 500 mΩor less, and more preferably 100 mΩor less. In the chip resistor thus constituted, the packaging efficiency and packaging speed to a circuit board can be improved.</p> |
