| 摘要 |
PROBLEM TO BE SOLVED: To facilitate dealing at carrying of a semiconductor chip in a manufac turing process of a semiconductor device by cutting out a chip block collectively having at least a plurality of semiconductor chips as one unit, and carrying the chip block by accommodating it in one jig. SOLUTION: A plurality of semiconductor chips 2 are formed on a main surface of a semiconductor wafer. In this step, starting from the state of a polished wafer, the respective processes such as film formation, photolithography, etching and impurity introduction have been appropriately repeated, a DRAM element is formed on the main surface, a wiring is formed on it, and the processes for protective film formation is completed. Continuuingly, a semiconductor chip 2 is cut out from the semiconductor wafer. That is, cutting-out is performed in units of chip block in a batch having at least a plurality of the semiconductor chips 2. For example, one chip block CB has four semiconductor chips 2. This chip block CB is accommodated in a carrier (jig) and carried to a inspecting equipment. |
