| 摘要 |
PROBLEM TO BE SOLVED: To reduce parts and assembly costs by commonly using an adhesive for fixing a laser chip at a determined position on a sub mount for transferring heat being generated by the laser chip to a heat sink and an airtight material for sealing the cutting surface of the laser chip. SOLUTION: In the manufacturing process of a laser chip 16, metallized surfaces 16c and 16d are generated at a part with a wide area where a semiconductor layer is laminated and a semi-transparent film is coated on a light emission surface 16a and a light emission surface rear surface 16b. Then, both of them are machined airtightly, but cutting surfaces 16e and 16f that appear as a result of cutting need to be protected from external air by a sealing agent or the like. In the assembly of a laser unit, the laser chip 16 adheres the metallized surface 16d to a determined position on the sub mount for fixing. At this time, an adhesive is applied to the cutting surfaces 16e and 16f at both sides, thus joining with the sub mount and at the same time sealing the cutting surfaces 16e and 16f. |
