发明名称 |
Semiconductor device having cap-metal layer |
摘要 |
A semiconductor device includes an insulating layer and an interconnection layer having a conductive layer provided over the insulating layer. The interconnection layer is patterned by photolithography. The device further includes a cap-metal layer, which is deposited on the conductive layer and suppresses reflection of light beams at the time of patterning the interconnection layer. The cap-metal layer has any one of the following structures: a double-layered structure having a titanium nitride layer and a titanium layer located between the titanium nitride layer and the conductive layer; a double-layered structure having a titanium nitride layer and an aluminum-titanium alloy layer located between the titanium nitride layer and the conductive layer; and a single-layered structure consisting essentially of an aluminum-titanium alloy. These design ensure accurate interconnection patterning in the photolithography, and provide improved EM and SM immunities of the interconnection.
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申请公布号 |
US5895265(A) |
申请公布日期 |
1999.04.20 |
申请号 |
US19970821769 |
申请日期 |
1997.03.20 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
INOUE, YASUNORI;TSUJIMURA, KAZUTOSHI;TANIMOTO, SHINICHI;YAMASHITA, YASUHIKO;YONEDA, KIYOSHI;IBARA, YOSHIKAZU |
分类号 |
H01L23/532;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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