| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for stably mass-producing IC cards. SOLUTION: In producing an IC card wherein parts contg. an IC chip are placed at a specified position between facing two base sheets and a resin is filled, after the resin to be filled is selected from thermosetting type, hot-melt type or ultraviolet-curable type resins and is provided on one base sheet as a resin layer, the parts contg. the IC chip are sealed in the resin layer by placing them on the resin layer and processing them by heating and/or pressing. In addition, if necessary, another base sheet 6 with a layer of a thermosetting type, a hot-melt type or an ultraviolet-curable type resin is laminated and is processed by heating and/or pressing. |
