| 摘要 |
PROBLEM TO BE SOLVED: To simplify the constitution, to make the processor inexpensive and to remarkably suppress damage such as a crack of a substrate and sticking of particles to the substrate surface. SOLUTION: A substrate carrier device 3 is designed not to carry a substrate 2 in the direction perpendicular to a surface to be processed of the substrate 2 but to carry the substrate 2 in the direction along the surface to be processed of the substrate 2. Within a clean room, a down flow F is positively utilized to prevent suspending of particles. The carrying of the substrate 2 between each process by the substrate carrier device 3 and various kinds of processings by each process are performed, holding the substrate 2 at a vertical or inclined attitude at an adsorption stage 43 in each process. Further, a plurality of processing parts performing the same processing are provided in heat processing parts 6 to 8, 10, 11. The substrate 2 can be pooled within a processing process for a long processing time and carrier time can be controlled by a shorter processing tact. |
