METHOD AND DEVICE FOR SURFACE-TREATING SUBSTRATES

摘要

The invention relates to a method for surface treatment of at least one substrate (1), which is electrically conductive or coated so as to be conductive, by means of a gas situated in the area of an electric discharge (2). The discharge area is delimited on at least two substantially opposite sides by the substrate surfaces (7) that are to be treated. This method is particularly suited for treating band-shaped, continuously conveyed substrates.