BURN-IN BOARD WITH ADAPTABLE HEAT SINK DEVICE

摘要

A system and method for burning-in an integrated circuit (40) comprises a socket (12) capable of receiving and supporting the IC (40), electrical leads (14) in the socket (12) for connecting to corresponding leads on the chip (40), and a heat sink in thermal contact with a cooling medium. A first thermal interface (22) provides releasable thermal contact between the integrated circuit (40) in the socket (12) and a resiliently mounted heat absorbing member (30). A second thermal interface is provided between the heat absorbing member (30) and the heat sink.