PACKAGING STRUCTURE USING BUFFING MATERIAL STRUCTURE,申请号KR19950026940-传众专利搜索

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发明名称	PACKAGING STRUCTURE USING BUFFING MATERIAL STRUCTURE
摘要
申请公布号	KR0186279(B1)	申请公布日期	1999.04.15
申请号	KR19950026940	申请日期	1995.08.28
申请人	LG ELECTRONICS CORP.	发明人	LEE, SANG-MOON;SIM, YOUNG-SOO;OH, CHANG-SUK;KIM, INN-DONG;PARK, HEE-CHOL
分类号	B65D81/127;(IPC1-7):B65D81/127	主分类号	B65D81/127
代理机构		代理人
主权项
地址

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