| 发明名称 |
Method for adhering a metallization to a substrate |
| 摘要 |
<p>An electrically insulating coating is formed on a substrate, the upper surface of the coating etched to roughen and form pits, and a metallisation applied to the pits.</p> |
| 申请公布号 |
EP0909119(A2) |
申请公布日期 |
1999.04.14 |
| 申请号 |
EP19980308095 |
申请日期 |
1998.10.05 |
| 申请人 |
FORD MOTOR COMPANY |
发明人 |
TODD, MICHAEL GEORGE;BAKER, JAY DEAVIS;RAGHAVA, RAM SINGH;GLOVATSKY, ANDREW Z. |
| 分类号 |
H01L21/48;H05K3/14;H05K3/16;H05K3/38;(IPC1-7):H05K3/38;C23C18/22;C23C14/20 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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