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发明名称
MOUNTING METHOD FOR FLAT PACKAGE ELECTRONIC COMPONENT
摘要
申请公布号
JPH1197833(A)
申请公布日期
1999.04.09
申请号
JP19970270351
申请日期
1997.09.18
申请人
SENJU METAL IND CO LTD;AIWA CO LTD
发明人
ZEN MITSUO;WATANABE MASAHIRO;KOMORI CHIAKI;FUKUDA HIDEAKI;USUHA TAKASHI
分类号
H05K3/34;H05K1/11;(IPC1-7):H05K3/34
主分类号
H05K3/34
代理机构
代理人
主权项
地址
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