| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device wherein a chip part mounted on a base substrate is sealed with a resin using a dam frame. SOLUTION: There are provided an edit substrate 1 in which a plurality of base substrates are two-dimensionally arranged with locating holes being provided, a dam frame substrate 4 in which dam frames and locating holes are provided in correspondence with the individual base substrates, and a locating tool 12 having a locating plate and guide pins 11. Each of the base substrates of the edit substrate 1 is provided with a chip part 7, followed by bonding an electrode of the chip part 7 with a pad portion formed on the base substrate. The edit substrate 1 which has been given the bonding treatment and the dam frame substrate 4 are alternately built up via bonding portions, by passing the guide pins 11 through the individual locating holes, thereby tightly bonding the edit substrate 1 with the dam frame substrate 4. Thereafter, a resin is implanted to the dam frame 4 to seal the chip part 7 on the base substrate, and the base substrates are separated from each other. |
