发明名称 PRESSURE-REDUCED DRYING DEVICE AND DRYING METHOD FOR SEMICONDUCTOR DEVICE USING DEVICE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To enhance the effect of washing, to prevent the occurrence of particles in pure water and to prevent re-contamination on a semiconductor device by the particle. SOLUTION: Pure water is continuously supplied into the inner tank of a pressure-reduced drying device using the vapor of isopryopyl alcohol containing an outer tank, the inner tank and a water feeding line through the above described water feeding line. After the inner tank is filled, the above described pure water is made to overflow continuously from the above described inner tank to the above described outer tank (430). Then, a semiconductor substrate is loaded in the above described inner tank, wherein the above described pure water is made to overflow continuously (450). Then, the vapor of the isopropyl alcohol is supplied into the above described inner tank, wherein this semiconductor substrate is loaded. Thereafter, this loaded semiconductor substrate is dried (500).</p>
申请公布号 JPH1197409(A) 申请公布日期 1999.04.09
申请号 JP19980200876 申请日期 1998.07.15
申请人 SAMSUNG ELECTRON CO LTD 发明人 BOKU SANKON;RISHIYO SAI
分类号 H01L21/304;F26B5/04;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
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